2uul BG01 4-in-1 ABCD BGA Reballing Stencil Set

Ready stock

USD 6.60 As low as USD 6.03
USD 6.46 -2%
3 Piece
USD 6.26 -5%
5 Piece
USD 6.03 -9%
10 Piece+
Wholesale Discount
Bulk order only
ID : 2uul BG01 4-in-1 ABCD BGA Reballing Stencil Set
Weight : 0.35 kg

2uul BG01 4-in-1 ABCD BGA Reballing Stencil Set for iPhone 8 to 16Pro Max (without 16e)

Product details

The 2UUL BG01 ABCD Reballing Stencil is an essential tool for professional mobile repair technicians. Designed for iPhone models from iPhone 8 up to iPhone 16 PM, this stencil allows precise solder ball placement during reballing of mobile motherboards. Made from premium, heat-resistant material, it ensures accuracy, durability, and consistent performance. Ideal for motherboard repairs, chip replacement, and professional iPhone repair shops. Each pack contains 4 stencils, covering multiple reballing tasks.

 

 

Additional Information

SKU 2uul BG01 4-in-1 ABCD BGA Reballing Stencil Set
Weight 0.350000
Customer Reviews
0.0 / 5.0

5 Star 5

0

4 Star 4

0

3 Star 3

0

2 Star 2

0

1 Star 1

0
Your Rating:
loader
Loading...

You submitted your review for moderation.