MaAnt 1.5M Low Residue No-clean Solder Wick

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ID : MaAnt 1.5M Low Residue
Weight : 0.15 kg
MaAnt 1.5M Low Residue No-clean Solder Wick for Phone PCB BGA Desoldering
Product details
- Fast tinning/low residue/oxidation resistance/no breakpoint/good effect/corrosion resistance
- Refined from pure copper and special chemical formula, to ensure fast, good and economical, it is used to absorb excess solder when removing tin, anti-oxidation and anti-corrosion, good thermal conductivity and tin absorption, and clean tin absorption
- The tin suction wire should be used when the pins of the soldering components are connected with tin, which can absorb the tin adhered to the pins and ensure that there is no short circuit between the pins.
- When re-balling BGA components, use tin-absorbing wire to clean the pads, which greatly increases the success rate of re-balling
- Scope of application: suitable for cleaning PCB boards and other solders
Additional Information
| SKU | MaAnt 1.5M Low Residue |
|---|---|
| Weight | 0.150000 |




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