Relife RL-044 Android Series BGA Reballing Stencil Set
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USD 42.30
As low as USD 38.66
USD 40.95
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3 Piece
USD 39.97
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5 Piece
USD 38.66
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ID : Relife RL-044 Android Series BGA Reballing Stencil Set
Weight : 0.48 kg
Relife RL-044 Android Series BGA Reballing Stencil Set for Qualcomm / MTK / Hisilicon / Exynos / EMMC BGA
Product details
- RL-044 Android series chip planting tin steel stencil set, precise alignment, fast and convenient, high-quality steel, round square holes, high-temperature resistance, no deformation
- Supports Qualcomm Snapdragon/Dimensity/Hisilicon Kirin/Exynos/BGA/Android and other series
- Use mobile phones for actual measurement to ensure accuracy, each mesh is calibrated according to the mobile phone drawings to ensure that every solder joint is indispensable
- It is specially designed and used for mobile phone chips, the round and square precise hole positions make the solder balls more rounded and meet the tin planting requirements for various chips
- Ultra-thin and super tough, ultra-thin design, better fit of tin planting, continuous bending, and full toughness
- High temperature and wear resistance, high-quality special steel is selected, which has good high-temperature resistance and metal fatigue resistance, so that each tin point is heated evenly
- The round and square precise hole position makes the solder balls more rounded and prevents the mesh holes from jamming the solder balls
Additional Information
| SKU | Relife RL-044 Android Series BGA Reballing Stencil Set |
|---|---|
| Weight | 0.480000 |
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