Relife RL-404 40g 138°C Low-Temperature Melting Point Lead-free Tin Paste

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As low as USD 2.89
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ID : Relife RL-404-1
Weight : 0.18 kg
Relife RL-404 40g 138°C Low-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA Repair
Product details
- RL-404 138°C lead-free low-temperature solder paste, a low-temperature lead-free solder paste customized for high-end motherboard repair
- Tin Lighting/Climbing Tin Strong/High Purity/Temperature Standard/Easy to Store
- Low Melting Point /High Density/High Resistance Strong Activity/Strong Welding Force
- Pure Alloy Composition/Fine Viscosity /Tin Plating Does Not Bubble Silver Highlights Good/Environmental Protection Without Any Chemical Pollution
- Meet the maintenance needs of motherboards for Huawei and Apple high-end machines
Additional Information
| SKU | Relife RL-404-1 |
|---|---|
| Weight | 0.180000 |

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